JPH0418699B2 - - Google Patents
Info
- Publication number
- JPH0418699B2 JPH0418699B2 JP60004123A JP412385A JPH0418699B2 JP H0418699 B2 JPH0418699 B2 JP H0418699B2 JP 60004123 A JP60004123 A JP 60004123A JP 412385 A JP412385 A JP 412385A JP H0418699 B2 JPH0418699 B2 JP H0418699B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- printed circuit
- polishing
- outer lead
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 claims description 40
- 239000004065 semiconductor Substances 0.000 claims description 39
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000003909 pattern recognition Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60004123A JPS61163650A (ja) | 1985-01-16 | 1985-01-16 | ボンデイングツ−ル研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60004123A JPS61163650A (ja) | 1985-01-16 | 1985-01-16 | ボンデイングツ−ル研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61163650A JPS61163650A (ja) | 1986-07-24 |
| JPH0418699B2 true JPH0418699B2 (en]) | 1992-03-27 |
Family
ID=11576007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60004123A Granted JPS61163650A (ja) | 1985-01-16 | 1985-01-16 | ボンデイングツ−ル研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61163650A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6899897B2 (en) | 2001-06-18 | 2005-05-31 | Jaleva, Inc. | Gum resin as a carrier for topical application of pharmacologically active agents |
| JP5192786B2 (ja) * | 2007-11-21 | 2013-05-08 | 芝浦メカトロニクス株式会社 | 電子部品の供給装置、実装装置、供給方法及び実装方法 |
-
1985
- 1985-01-16 JP JP60004123A patent/JPS61163650A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61163650A (ja) | 1986-07-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |